The PCB (基板) in SEMS08 contains restricted substances (lead, mercury, cadmium, hexavalent chromium, PBB, PBDE) at levels not exceeding the percentage of reference value.
03
Casing Restricted Substances Compliance
The casing (外殼) in SEMS08 contains restricted substances (lead, mercury, cadmium, hexavalent chromium, PBB, PBDE) at levels not exceeding the percentage of reference value.
The passive component (被動元件) in SEMS08 has a lead exemption and contains mercury, cadmium, hexavalent chromium, PBB, PBDE at levels not exceeding the percentage of reference value.
05
IC Restricted Substances Compliance
The IC (積體電路) in SEMS08 contains restricted substances (lead, mercury, cadmium, hexavalent chromium, PBB, PBDE) at levels not exceeding the percentage of reference value.
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